Modern GPU clusters consume 300-500 W per compute node; multi-node facilities reach 1-2 MW thermal load. Cleanroom adjacency for medical imaging and process isolation for genomics demand multidisciplinary engineering precision.
Direct-to-Chip cooling enabling PUE below 1.1. Two-Phase Immersion Cooling for 5-6x density. Cleanroom-adjacent design. Waste heat recovery for facility HVAC and district heating.
Redundant power (N+1, N+2) for 99.99% uptime. UPS for HPC transient loads. Generator integration with automated transfer switches.
Strategic consulting, 3D thermal modelling, CFD analysis, modular construction, and remote monitoring infrastructure.
We combine thermal authority, research facility expertise, and dual-jurisdiction regulatory mastery for mission-critical HPC environments.
DISCUSS YOUR PROJECTEngineering the future of critical infrastructure.